Semiconductor


Front of Line Products

Front of Line Products

Specialized in various kind of tooling for semiconductor industries from front of line to the end of line. We customise or design to customer's requirements. We have a wide range of material selections for this category of product.

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Die Attached Tools 1

Die Attached Tools 1

Specialized in providing high quality die attached tools to meet the industrial needs. We also have Dispensing Nozzle to provide proper Epoxy coverage on die.

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Die Attached Tools 2

Die Attached Tools 2

Customized needle pattern configuration is available to meet various die size. We produce Rubber Tips and Suction Cup for both Epoxy & Soft Solder Die-attached process. It is antistatic - "Non-Sticking" and be able to solve die scratch problem.

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Wire Bonder Jigs

Wire Bonder Jigs

Specialized in designing and fabricating of various models of wire bonding jigs such as ASM339, ASMEagle60, K&S Maxμmplus, MaxμmUltra, Shinkawa UTC1000, UTC-100, 200 & etc.

Testing Socket

Testing Socket

Docking interfaces for testers, handlers and probers for example Catalyst to North Star docking. Change kit and nest for handlers for example North Star, Synax and MT9510 handlers. Ring insert, ring adapter and combination of head plate for probers for example TEC 78S, P8 probers. This only applies to combination head plate modification only. Sockets and socket covers for example Pogo pins socket, duplication of existing sockets for R & D to suit new tester.

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